Tin-lead (Sn-Pb} solders are widely employed in microelectronic industries due to their superior wetting properties, moderate melting temperature, and low cost. However, it is widely known that solder based on Pb is harmful to health and the environment. Therefore, an alternative solder alloy that is free from Pb needs to be developed. As replacements, Sn-Ag-Cu solder al oy have been investigated. Despite the general acceptance of these solders as the leading Pb-free solders, they do have number of disadvantages, including a relatively high melting temperature. A higher melting point leads to 2(}.30"C increase in the peak reflow temperature required for assembly compared to that required for Sn-Pb eutectic solder. An increased temperature is detrimental to many microelectronic components, making assembly very difficult. A low processing temperature is desirable for preventing heat damage to electronic devices during soldering.